Neusoft Smart Go and GigaDevice Launch Strategic Cooperation to Jointly Empower the Future of the Intelligent Vehicle Industry
On July 22, Neusoft Smart Go and GigaDevice announced a strategic cooperation, leveraging GigaDevice’s high-performance, highly reliable automotive-grade chips and Neusoft Smart Go’s full-domain technical expertise and mass production experience in upper-body automotive electronics. The two sides will jointly develop more competitive intelligent solutions for intelligent cockpits, intelligent communication, central computing platforms, cockpit-driving-parking integration and zone controllers, to drive the automotive industry’s upgrading.
As automotive E/E architecture rapidly shifts toward domain centralization and cross-domain integration, deep collaboration between chip vendors and automotive component suppliers has become critical to boost full-vehicle supply chain resilience and speed up cutting-edge hardware deployment. Neusoft Smart Go, a subsidiary of Neusoft Corporation in the field of intelligent vehicle connectivity, holds deep expertise in intelligent cockpits and central computing platforms. It pioneered integrating large AI models into its product portfolio, and has won broad trust from leading global automakers with its outstanding “hardware + software + services” integrated development capabilities.
GigaDevice is a leading global fabless supplier with years of in-depth cultivation in the automotive electronics sector. Its cumulative shipment of automotive-grade Flash chips deployed in vehicles has exceeded 450 million units. Relying on its high-performance, high-security automotive MCUs and complete product matrix, GigaDevice has built a comprehensive and robust underlying ecosystem for automotive chips. This deepened strategic cooperation not only leverages complementary strengths to seize industry upgrading trends, but also drives the technological evolution and ecosystem maturity of the automotive electronics industry.
Under the agreement, the two sides will cooperate across three key dimensions: first, deepen the integration of automotive-grade chips and applications, accelerating the full adaptation and large-scale deployment of GigaDevice’s automotive storage and MCUs in Neusoft Smart Go’s in-vehicle product matrix to unlock new collaborative efficiency; second, build a secure and reliable supply chain assurance system, leveraging GigaDevice’s mature mass production capacity and Neusoft Smart Go’s market resources to boost supply chain response efficiency; third, advance industrial ecosystem cooperation and co-construction, jointly conducting chip access testing, connecting high-quality upstream and downstream resources, and building a safe, collaborative and sustainable intelligent vehicle industry ecosystem.
Jian Guodong, Senior Vice President of Neusoft Corporation and CEO of Neusoft Smart Go, stated: “As automotive E/E architectures keep upgrading, high-performance automotive-grade chips serve as the solid foundation for hardware-software integrated products. Leveraging GigaDevice’s automotive lineup’s extensive mass production experience, this partnership will break traditional supply chain boundaries, to jointly deliver intelligent vehicle hardware-software integrated solutions with stronger competitiveness, safety resilience and self-evolution capabilities for automakers.”
Li Wenxiong, Vice President of GigaDevice and General Manager of its Automotive Business Unit noted, “Neusoft Smart Go is a world-leading provider of full-domain solution for intelligent vehicle upper-body electronics, with deep technical strengths in system-level integration and hardware-software synergy. This strategic cooperation represents a deep tie-up between chips and in-vehicle intelligent system platforms. We will fully utilize our respective strengths to consistently drive the high-quality development of the automotive industry.”
Moving forward, GigaDevice and Neusoft Smart Go will leverage this strategic partnership as a key opportunity, closely align with the evolving E/E architecture trends, and jointly advance the automotive electronics industry’s technological evolution and ecosystem co-construction with a more robust hardware foundation and proven system-level integration capabilities.
